GSTDTAP  > 地球科学
DOI10.1126/science.aan4797
Nanocrystalline copper films are never flat
Zhang, Xiaopu1,2; Han, Jian3; Plombon, John J.4; Sutton, Adrian P.5; Srolovitz, David J.3,6; Boland, John J.1,2
2017-07-28
发表期刊SCIENCE
ISSN0036-8075
EISSN1095-9203
出版年2017
卷号357期号:6349页码:397-399
文章类型Article
语种英语
国家Ireland; USA; England
英文摘要

We used scanning tunneling microscopy to study low-angle grain boundaries at the surface of nearly planar copper nanocrystalline (111) films. The presence of grain boundaries and their emergence at the film surface create valleys composed of dissociated edge dislocations and ridges where partial dislocations have recombined. Geometric analysis and simulations indicated that valleys and ridges were created by an out-of-plane grain rotation driven by reduction of grain boundary energy. These results suggest that in general, it is impossible to form flat two-dimensional nanocrystalline films of copper and other metals exhibiting small stacking fault energies and/or large elastic anisotropy, which induce a large anisotropy in the dislocation-line energy.


领域地球科学 ; 气候变化 ; 资源环境
收录类别SCI-E
WOS记录号WOS:000406362300044
WOS类目Multidisciplinary Sciences
WOS研究方向Science & Technology - Other Topics
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文献类型期刊论文
条目标识符http://119.78.100.173/C666/handle/2XK7JSWQ/196546
专题地球科学
资源环境科学
气候变化
作者单位1.Trinity Coll Dublin, Sch Chem, CRANN, Dublin 2, Ireland;
2.Trinity Coll Dublin, Adv Mat & Bioengn Res AMBER, Dublin 2, Ireland;
3.Univ Penn, Dept Mat Sci & Engn, Philadelphia, PA 19104 USA;
4.Intel Corp, Components Res, Hillsboro, OR 97124 USA;
5.Imperial Coll London, Dept Phys, Exhibit Rd, London SW7 2AZ, England;
6.Univ Penn, Dept Mech Engn & Appl Mech, Philadelphia, PA 19104 USA
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GB/T 7714
Zhang, Xiaopu,Han, Jian,Plombon, John J.,et al. Nanocrystalline copper films are never flat[J]. SCIENCE,2017,357(6349):397-399.
APA Zhang, Xiaopu,Han, Jian,Plombon, John J.,Sutton, Adrian P.,Srolovitz, David J.,&Boland, John J..(2017).Nanocrystalline copper films are never flat.SCIENCE,357(6349),397-399.
MLA Zhang, Xiaopu,et al."Nanocrystalline copper films are never flat".SCIENCE 357.6349(2017):397-399.
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